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논문 기본 정보

자료유형
학술저널
저자정보
저널정보
한국전기전자재료학회 전기전자재료학회논문지 전기전자재료학회논문지 제22권 제7호
발행연도
2009.1
수록면
595 - 601 (7page)

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For the silicon oxide (SiOx) films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration(O2/Ar+O2) introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the SiOx films are as follows: dTS and dTT are 90 mm and 120 mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3 %. Under this optimum conditions, it was found that the SiOx film was grown with a very high deposition rate of 250 Å/min by rf-power of 4.4 W/㎠, which was significantly enhanced as compared with a deposition rate (∼55 Å/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

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